Library · Materials, chemistry & fabrication
What Chemical Etching & Surface Micromachining got wrong, from 53 theses
Summary written by a model from the records below: Chemical etching and surface micromachining processes frequently encounter mechanical failures such as stiction and cracking during sacrificial release, along with selectivity and profile control issues. Fabrication yields are further limited by aspect ratio dependent lag, surface roughening, and chemical degradation of delicate layers. These records come from graduate theses, 2021 to 2026, each labeled with its degree where the repository states it, and each links to its thesis. They were extracted by language models reading the full text, so treat each as a lead to read, not a verdict.
Plus 9 problems the authors left open, listed at the end.
Failure modes, by theses reporting them
Select a mode to jump to its records.
Sacrificial release etching causes structural collapse from capillary stiction and internal stress
Capillary forces and surface tension during wet release drying pull suspended membranes and cantilevers into contact with substrates, leading to irreversible stiction and structural failure. Additionally, unrelieved internal film stress, severe solution agitation, and incomplete oxide removal cause suspended structures to warp, crack, or detach at anchor points.
Tried and failed
stress-engineered suspension supports applied to suspended microcavity release etching. Reason: structural collapse caused by stiction failure during release etch
Resonant Spatial Light Modulation: Optical Programming and Sensing at the Fundamental Limit · MIT · PhD
Tried and failed
full-wafer wet etching without pre-dicing applied to silicon micro-oscillator fabrication. Reason: released structures stuck together and shattered during solution agitation
Measurement of phonon angular momentum via the Einstein-de Haas effect, fiber-optic interferometry, and a high-Q oscillator · UT Austin · PhD
Considered and rejected
Considered and rejected: Rejected surface micromachining in favor of SOI bulk micromachining due to high residual stresses causing buckling/cracking and limited displacement.
Development of MEMS-Based Devices for Characterizing 2D Nanomaterials at Low Temperatures · University of Trento · PhD
Tried and failed
wet chemical under-etching for suspended membrane release applied to thin-film diamond photonic crystal membranes. Outcome: unstable. Reason: Capillary forces during wet etching caused thin membranes to collapse and stiction to the underlying substrate
High-Performance Photonic and Acoustic Interfaces for Qubits · Harvard · PhD
Tried and failed
frontside isotropic chemical etching for membrane release applied to suspended piezoelectric thin-film resonators. Outcome: unstable. Reason: unrelieved internal stress caused severe film cracking and substantial structural warpage after release
AlScN-Based Acoustic Resonators Utilizing Piezoelectric and Ferroelectric Effects · Georgia Tech · PhD
Tried and failed
sacrificial isotropic gas etching for suspended membranes applied to integrated microelectronic device electrodes. Reason: incomplete sacrificial layer removal left residues and caused stress-induced cracking in the suspended metal film
Vacuum Transistors Based on III-Nitrides Field Emitter Arrays with Self-Aligned Gate · MIT · PhD
Tried and failed
vapor hydrofluoric acid cavity release etching applied to silicon-on-insulator buried oxide sacrificial layer. Reason: defective or low-quality oxide layer caused uncontrolled lateral etch propagation destroying structural anchors
Integration of MEMS in Silicon Photonics · EPFL · PhD
Tried and failed
evaporated metal oxide sacrificial layer wet release applied to metallic nanostructure transfer to flexible substrates. Reason: thin-film stress caused partial or entire structure dislocation during wet chemical etching
Tried and failed
sacrificial layer wet etching without sonication applied to microparticle release from layered substrates. Reason: released particles agglomerated instead of dispersing freely into suspension
Scalable development of multiplexed microparticle technologies for optical single-cell barcoding · MIT · PhD
Considered and rejected
Considered and rejected: Rejected liquid/wet etching of RuO2 (e.g., ceric ammonium nitrate) for HAR catalyst removal due to capillary-force-induced pattern collapse during liquid drying
Reducing manufacturing constraints of metal-assisted chemical etching · UT Austin · PhD
Considered and rejected
Considered and rejected: Rejected single-side or standard backside-only KOH wet etching due to ~3 µm misalignment/TTV errors that caused cantilever clamping overhang or incomplete release.
Ultra small biomorphic cantilevers for high-speed atomic force microscopy · EPFL · PhD
Insufficient etch selectivity leads to mask erosion and destructive attack on underlying layers
Wet and dry etchants often lack adequate chemical selectivity, resulting in premature mask stripping, pinhole enlargement, and hard mask degradation. Consequently, etchants attack bonded interfaces, underlying adhesion layers, and functional electrodes, causing delamination and device failure.
Tried and failed
single-sided through-wafer deep reactive-ion etching applied to silicon microfluidic channel fabrication. Reason: mask erosion degraded the etch mask before full wafer penetration
Paving the Way for Reliable Electrospray Propulsion through Materials Science and Design · MIT · PhD
Tried and failed
wet chemical etching of chromium hard masks applied to oxide thin film ion milling. Reason: isotropic wet etching caused severe dimensional bias and feature degradation
Infrared electro-optical modulators leveraging plasmonic and nonlinear materials · UT Austin · PhD
Tried and failed
selective wet chemical etching of semiconductor heterostructures applied to low-arsenic quaternary III-V microcavities. Reason: insufficient etch selectivity due to chemical compositional similarity causes surface damage and degrades optical performance
Scalable development of multiplexed microparticle technologies for optical single-cell barcoding · MIT · PhD
Tried and failed
isotropic wet etching with hard mask applied to submicron semiconductor multilayer patterning. Reason: excessive lateral undercut stripped the protective hard mask entirely at small feature sizes
Mid-infrared ballistic metamaterials and subdiffraction limited photonic funnels · UT Austin · PhD
Tried and failed
selective chemical wet etching for hard mask removal applied to heterogeneous bonded semiconductor substrate. Outcome: unstable. Reason: the acid etchant attacked the underlying bonded interface and substrate material causing severe undercutting
Hybrid germanium-on-zinc selenide platform for photonic integrated circuits in the longwave infrared · UT Austin · PhD
Tried and failed
dopant-selective wet etching using polymer masks applied to degenerately phosphorus-doped silicon. Reason: phosphorus-doped silicon lacked etch-stop behavior, leading to non-selective polymer mask removal
Bottom-up Process Development for High Throughput Electronic Device Fabrication · Georgia Tech · PhD
Tried and failed
dopant-selective wet chemical etching applied to n-type patterned silicon substrates. Outcome: did not generalise. Reason: phosphorus doping lacked the etch selectivity contrast observed with boron doping
Engineering a self-aligned metal-oxide-semiconductor gate stack for nano-modular device fabrication · Georgia Tech · PhD
Tried and failed
selective chemical etching of mold templates applied to intermetallic and semimetal nanowires. Reason: acid selectively etched constituent elements from target compounds causing structural degradation and dissolution
Thermomechanical Nanomolding of Electronic Materials · Cornell · PhD
Tried and failed
two-step chemical wet etching applied to piezoelectric thin films on titanium electrodes. Outcome: unstable. Reason: acid etchants corroded the underlying titanium adhesion layer, causing electrode delamination
Additive Fabrication of Functional Microfluidic Devices · EPFL · PhD
Considered and rejected
Considered and rejected: Rejected SiO2 passivation layers patterned by wet etching because the wet etchant attacked and dissolved the metallic Al electrodes.
Considered and rejected
Considered and rejected: Rejected pure wet chemical etching of PZT with hot HCl due to Ti adhesion layer corrosion
Additive Fabrication of Functional Microfluidic Devices · EPFL · PhD
Considered and rejected
Considered and rejected: Cl2 ICP-RIE dry etching for Al0.6Sc0.4N patterning was rejected in favor of pure physical Ar Ion Beam Etching (IBE) due to very poor selectivity to photoresist (1:6) and significant etch rate degradation with high Sc doping.
High Scandium concentration AlScN resonators for 5G applications · EPFL · PhD
Isotropic etching profiles cause excessive lateral undercutting and destroy adjacent fine features
Non-directional chemical reactions cause pronounced lateral undercutting beneath etch masks and dielectric layers, leading to electrical shorting and structural weakening. This isotropic removal also strips protective boundaries and destroys adjacent waveguides, microfluidic walls, and suspension springs.
Tried and failed
hydrofluoric acid wet chemical etching applied to optical waveguide fabrication. Reason: isotropic etching degraded cross-sectional profile and poor selectivity reduced waveguide height
Integrated Visible-Light Platforms, Devices, and Systems for Augmented Reality and Beyond · MIT · PhD
Tried and failed
fine nanoscale finger projections on patterned electrodes applied to single-electron transistor gate electrodes. Reason: narrow feature geometry caused lift-off defects and sustained damage from reactive-ion etching undercutting
Nanofabrication, measurement, and microscopy of ~10 nm scale single electron transistors · Imperial · PhD
Tried and failed
deep reactive ion etching applied to bulk refractory metal microchannels. Reason: severe sidewall undercutting caused internal leakage between adjacent fluid channels
Design, fabrication and test of the iridium catalysed electrolysis (ICE) thrusters · Imperial · PhD
Tried and failed
isotropic wet chemical etching of thin dielectric applied to metal-insulator-metal multilayer stack. Reason: severe undercutting of the dielectric spacer layer caused electrical shorting between adjacent metal electrodes
A Microwell-Based Impedance Sensor In Microneedle Shape For Cytokine Detection · Penn · PhD
Considered and rejected
Considered and rejected: Rejected photochemical wet etching because isotropic etch profiles impose severe geometric restrictions on microscale fluidic thruster channels.
Design, fabrication and test of the iridium catalysed electrolysis (ICE) thrusters · Imperial · PhD
Considered and rejected
Considered and rejected: Rejected isotropic wet etching for etching sub-micron pattern features in SiO2 in favor of dry reactive ion etching (RIE with CHF3/Ar) to maintain feature profile and avoid electrical shorting.
Building and Characterizing Graphene Nanomechanical Resonator Networks · University of Oregon · PhD
Considered and rejected
Considered and rejected: Pure SF6 dry etch without fluorocarbon/passivation rejected for high-aspect-ratio couplers due to isotropic etching profiles and residual polymer bridging
Hybrid germanium-on-zinc selenide platform for photonic integrated circuits in the longwave infrared · UT Austin · PhD
Tried and failed
isotropic wet etching for structural suspension applied to integrated photonic waveguides and resonators. Reason: the unmasked wet etchant destroys adjacent narrow waveguide structures during sacrificial layer release
A Heterogeneous Integrated Photonic Platform for High Sensitivity Sensors · Georgia Tech · PhD
Considered and rejected
Considered and rejected: Rejected pure reactive gas etching (e.g., using XeF2 or O2 at elevated temperatures) and wet chemical etching for 2D material patterning because they degrade remaining layers and cause isotropic etch profiles/chemical contamination.
Tried and failed
continuous isotropic gas etching for cavity release applied to suspended membrane over micropillar arrays. Reason: etched structural pillars laterally causing premature membrane release instead of clearing cavity
Capillary-Driven Condensation for Heat Transfer Enhancement in Steam Power Plants · MIT · PhD
Considered and rejected
Considered and rejected: Rejected isotropic wet etching (1:1:1 HF:HNO3:H2O) for mesa isolation due to inconsistent, uncalibrated etch rates, replacing it with anisotropic dry etching and lift-off.
Intercalation-Based Memristors for Temporal Computation and Neuromorphic Architectures · Georgia Tech · PhD
Tried and failed
segmented deep silicon dry etching applied to thick silicon wafer handle layer. Reason: cumulative lateral under-etching destroyed delicate adjacent suspension springs
Mass-Producible Teleoperated Ambulatory Micro-Bots with Energy Harvesting and Video Reconnaissance Capabilities · Cornell · PhD
Etching induces surface roughness, sidewall sloped tapering, and performance-limiting residues
Incomplete dry etch clearing and harsh chemical attacks generate substantial bottom and sidewall roughness along with non-vertical, tapered profiles. These morphological imperfections and residual polymer depositions increase optical and acoustic propagation losses while severely degrading electrical transconductance.
Tried and failed
sidewall metallization liftoff after deep reactive ion etching applied to microfluidic channel electrodes. Reason: channel bottom and sidewall roughness and micromasking caused liftoff failure
CT On A Chip: Enabling High-Resolution Polar In-Situ Data Collection · Georgia Tech · PhD
Lost to a baseline
HEMT transconductance dropped sharply when finger width W was reduced below 2 µm due to sidewall edge damage from wet mesa etching, underperforming 10 µm width devices.
Cryogenic HEMT-based devices and circuits for quantum computing · EPFL · PhD
Lost to a baseline
Femtosecond laser engraving could not achieve high aspect ratios (HAR) typical of Deep Reactive-Ion Etching (DRIE), producing instead 20-degree sloped sidewalls that caused triangular cross-sections for widths <100 µm.
Interlocking modular microfluidic cooling substrates for future high energy physics experiments · EPFL · PhD
Lost to a baseline
Experimental waveguide insertion loss of ~7.2 dB was significantly worse than the simulated loss of ~2 dB due to etching roughness and residues
Flip-chip integrated terahertz quantum cascade lasers · TU Wien · PhD
Tried and failed
low-temperature chlorine inductively coupled plasma etching applied to III-V semiconductor heterostructures. Reason: produced sloped sidewalls with poor etch selectivity and microtrenching defects
On-chip III-V semiconductor network lasers for neuromorphic computing · Imperial · PhD
Tried and failed
fluorine-based dry etching of microresonator coupling gaps applied to semiconductor optical microresonators. Outcome: worse than baseline. Reason: residual polymer deposition in submicron gaps could not be polished away, degrading the quality factor
Hybrid germanium-on-zinc selenide platform for photonic integrated circuits in the longwave infrared · UT Austin · PhD
Tried and failed
grayscale lithography combined with deep reactive-ion etching applied to silicon microchannel 3D profile patterning. Reason: sub-100nm resist thickness non-uniformities caused striations and major etch depth variations
Solid-State Flow Control for Ion Electrospray Propulsion · MIT · PhD
Tried and failed
semi-additive copper plating for transmission lines applied to high-frequency embedded die glass packaging. Outcome: worse than baseline. Reason: over-exposure and over-etching caused metal strip edge roughness, leading to excess transmission line loss
Glass Based Packaging for Beyond 5G Communication · Georgia Tech · PhD
Lost to a baseline
Scattering Q of rectangular OMCs from quasi-isotropic etching reached 4.71 x 10^4, an order of magnitude lower than RIBAE with HSQ-alumina (2.50 x 10^5).
Quantum Optomechanics with Color Centers in Diamond · Harvard · PhD
Lost to a baseline
Suspended AlN-on-diamond acoustic waveguides exhibited higher loss (-50 dB transmission) compared to ridge acoustic waveguides (-22.4 dB transmission) due to modal mismatch and bottom surface roughness from quasi-isotropic etching.
High-Performance Photonic and Acoustic Interfaces for Qubits · Harvard · PhD
Aggressive chemical etchants cause corrosive damage and structural crumbling in delicate thin films
Exposure to strong alkaline or acid solutions leads to wafer embrittlement, thin film dissolution, and insoluble interfacial residue accumulation. In transfer processes, wet etchants corrode and crumble delicate two-dimensional materials and organic polymers, destroying their electronic and mechanical properties.
Tried and failed
single-sided wet etching through wafer applied to silicon microfluidic device fabrication. Reason: prolonged etching caused severe wafer brittleness and very low manufacturing yield
Continuous Antibody Titer Assessment of the Biomanufacturing Process using Nanofluidic Binding Assays · MIT · PhD
Tried and failed
continuous single-solvent alkaline wet etching applied to polymer-masked silicon substrates. Reason: poor polymer solvation and accumulation of insoluble potassium-silica complexes at the interface
Bottom-up Process Development for High Throughput Electronic Device Fabrication · Georgia Tech · PhD
Tried and failed
wet chemical etching of sacrificial layer applied to substrate preparation for epitaxial growth. Reason: residual organic carbon contaminant degraded selective growth during high-temperature annealing
Selective-area molecular beam epitaxial growth towards monolithic 3D integration of dielectrics and semiconductors · UT Austin · PhD
Considered and rejected
Considered and rejected: Rejected PMMA wet-transfer using KOH etching due to crumbling, polymer residue, and chemical deterioration of monolayer MoS2, choosing water-assisted PDMS dry stamping instead
Molybdenum disulphide nanoporous membranes as nanofluidic platforms - large-area engineering and study · EPFL · PhD
Considered and rejected
Considered and rejected: Rejected chemical wet-etching / Raney-type de-alloying (Pt/Al, Pt/Ni, Pt/Zn) for porous Pt due to chemical aggressiveness destroying ultra-thin membranes and toxicity of residual metals.
Considered and rejected
Considered and rejected: Rejected PMMA-assisted wet-etching wafer transfer using KOH/NaOH due to corrosive damage, defect induction, and thin-film crumbling.
2D MoS2 Nanopores: Wafer-scale Fabrication and Monolayer Stability for Long-term Single-Molecule Sensing · EPFL · PhD
Considered and rejected
Considered and rejected: Rejected conventional dry etching or laser writing doping for P3CPT patterning due to severe degradation of polymer electronic properties.
Liquid gated organic devices for sensing applications: from transistors to single molecule break junctions · Politecnico di Torino · PhD
Tried and failed
chemical and plasma oxidation etching applied to laser-machined diamond surfaces. Reason: standard oxidative treatments failed to completely remove the laser-induced amorphous carbon layer
Advances in Instrumentation for Dynamic Nuclear Polarization & Magic-Angle Spinning NMR · MIT · PhD
High aspect ratio structures suffer from transport limitations and etch depth lag in narrow gaps
Narrow trenches and submicron cavities restrict reactant diffusion and fluid flow, creating severe aspect ratio dependent etching lag and incomplete material clearance. These transport constraints produce backpressure, structural cracking, and uneven over-etching of surrounding wider features.
Tried and failed
selective wet chemical etching of oxide cladding applied to sub-200 nm slot waveguide gaps. Reason: insufficient etchant penetration or excessive difficulty clearing narrow sub-200 nm high-aspect-ratio trenches
Scalable Packaging and Integration Solutions for Next-Generation Photonic Systems · MIT · PhD
Tried and failed
single-run deep reactive-ion etching applied to high-aspect-ratio silicon microstructures with varied gap sizes. Reason: aspect-ratio-dependent etching caused narrow gaps to clear too slowly, leading to over-etching and breakage of fine features
Mass-Producible Teleoperated Ambulatory Micro-Bots with Energy Harvesting and Video Reconnaissance Capabilities · Cornell · PhD
Tried and failed
standard commercial foundry dry etching applied to sub-micron photonic crystal hole arrays. Reason: default etch parameters caused oblique sidewalls and incomplete etching at ~200 nm feature sizes
Resonant Spatial Light Modulation: Optical Programming and Sensing at the Fundamental Limit · MIT · PhD
Tried and failed
dry etching of atomic layer deposited alumina applied to bottom contacts in high-aspect-ratio microchannels. Outcome: no signal. Reason: dry etching failed to clear alumina from bottom pads in high aspect ratio channels, blocking electrical contact
Amorphous Silicon Based Microchannel Plates for Time-of-Flight Positron Emission Tomography · EPFL · PhD
Tried and failed
highly diluted selective chemical wet etching applied to semiconductor nanowire surface planarisation. Reason: diffusion-limited reactant transport caused severe surface roughness across macroscopic sample areas
Ultra-scaled III-V Vertical Tunneling Transistors · MIT · PhD
Tried and failed
injection-based solvent etching of sacrificial material applied to high-resistance heterogeneous microchannel networks. Reason: fluid shunting and excessive backpressure caused structural cracking in high-resistance and mismatched-diameter channels
Negative Enrichment of Circulating Tumor Cells Via 3D Printed Microfluidic Device · Georgia Tech · PhD
Considered and rejected
Considered and rejected: Rejected thick photoresist masks (~2 µm) for submicron etching because high-aspect-ratio nanoscale resist features could not achieve sufficient etch resistance.
Scaling In Lithium Niobite: Synaptic Devices for Neuromorphic Computing · Georgia Tech · PhD
Metal-assisted chemical etching exhibits catalyst detours and non-directional porous etching
Catalytic metal patterns can wander or detour during vertical descent, which causes adjacent nanoscale holes and bridges to merge. Sub-optimal process temperatures and non-uniform catalyst deposition also result in undesirable porous layer formation and inconsistent etch depths instead of vertical directional removal.
Tried and failed
gas-phase metal-assisted chemical etching applied to silicon micro- and nanostructuring. Reason: sub-optimal temperatures caused porous layer formation and minimal vertical etching rather than directional removal
Platinum assisted chemical etching of single- and poly-crystalline silicon with applications to templated nanomaterials · UT Austin · PhD
Tried and failed
metal-assisted chemical etching with thin metal catalyst applied to dense high-aspect-ratio hole arrays. Reason: catalyst detoured during vertical descent causing adjacent nanoscale holes and bridges to merge
Integrated photonic devices for trace gas sensing and spectroscopy · UT Austin · PhD
Tried and failed
metal-assisted chemical etching applied to integrated optical waveguides and resonators. Reason: variable catalyst density caused non-uniform etch depths and distorted microstructures
Hybrid germanium-on-zinc selenide platform for photonic integrated circuits in the longwave infrared · UT Austin · PhD
Left open by the authors
Problems the authors named and did not get to.
Left open
Develop a drift compensation method and refine the soft sensor skin fabrication process to reduce inter-unit repeatability errors. Blocker: Requires multi-material 3D printing hardware, wet etching/lamination lab equipment, and physical sensor fabrication
A data-driven method to reduce excessive contact pressure of hand orthosis using a soft sensor skin · Imperial · PhD
Left open
Identify physical failure mechanisms underlying resistance slope changes in Kirigami interconnects during cyclic stretching up to one million cycles. Blocker: Requires fabricated micro-kirigami interconnect samples and physical cyclic stretch-testing apparatus with in situ microscopy or electromechanical characterization.
Conformable neural interfaces : from engineering stretchability at the micro-scale to translational applications · EPFL · PhD
Left open
Replace toxic HF in MACE etching using low-concentration solutions, KOH, or mechanical roughening to fabricate porous silicon contacts. Blocker: Requires a wet chemistry and semiconductor fabrication lab with chemical etching apparatus.
Soft Sensors in digital healthcare monitoring · Imperial · PhD
Left open
Develop a low-electrolyte-concentration cleaning etch to eliminate non-uniform underside surface profiles and residual substrate material on SiC membranes. Blocker: Requires a wet lab, chemical etching equipment, and physical SiC membrane samples.
Integrating Spin Defects with Thin-Film Silicon Carbide Devices · Harvard · PhD
Left open
Investigate substrate undercut etching techniques on commercial CMOS nodes to improve thermal dissipation and tuning efficiency of Bragg grating filters. Blocker: Requires access to advanced semiconductor fabrication facilities and cleanroom etching tools.
CMOS Fabrication-Compatible Bragg Grating Devices and Applications · Georgia Tech · PhD
Left open
Calibrate silicon dioxide etching to reduce sidewall transfer lithography nanoscale feature widths below 100 nm. Blocker: Requires a semiconductor cleanroom and physical nanofabrication/etching equipment (RIE/DRIE).
STL NEMS fabrication, design, and inspection · Imperial · PhD
Left open
Optimize the sacrificial etching process to undercut the InP substrate without damaging QCL and QCD structures. Blocker: Requires a physical semiconductor fabrication cleanroom and wet/dry etching lab equipment
Near- and mid-infrared integrated photonic bio-chemical sensing devices with on-chip spectrometers · UT Austin · PhD
Left open
Resolve fabrication obstacles including lagging, notching, knifing, and passivation during high-aspect-ratio DRIE of 4H-SiCOI substrates. Blocker: Requires a semiconductor cleanroom and DRIE etching equipment to conduct physical microfabrication experiments
Applications of New Materials Systems and Machine Learning Techniques for compensation and Calibration of MEMS · Georgia Tech · PhD
Left open
Perform selective etching of binary nanosphere monolayers using HF or toluene to tune fill-factor and pitch without reactive ion etching. Blocker: Requires a chemistry wet lab and hazardous chemical handling (HF, toluene) for physical nanosphere etching.
Who has worked on this
Authors of the public theses cited on this page, most-cited first.
- Landon Ivy · Cornell · PhD · 2025
Mass-Producible Teleoperated Ambulatory Micro-Bots with Energy Harvesting and Video Reconnaissance Capabilities - Weiyi Ding · Harvard · PhD · 2025
High-Performance Photonic and Acoustic Interfaces for Qubits - Mustafa Mohieldin Fadlelmula Fadlelseed · EPFL · PhD · 2024
Additive Fabrication of Functional Microfluidic Devices - Christopher L. Panuski · MIT · PhD · 2022
Resonant Spatial Light Modulation: Optical Programming and Sensing at the Fundamental Limit - Charles Muir · Imperial · PhD · 2022
Design, fabrication and test of the iridium catalysed electrolysis (ICE) thrusters - Paul H. Dannenberg · MIT · PhD · 2021
Scalable development of multiplexed microparticle technologies for optical single-cell barcoding - Amar T. Mohabir · Georgia Tech · PhD · 2021
Bottom-up Process Development for High Throughput Electronic Device Fabrication - Charity Wangari · MIT · PhD · 2026
Paving the Way for Reliable Electrospray Propulsion through Materials Science and Design - Marie Christine Ertl · TU Wien · PhD · 2026
Flip-chip integrated terahertz quantum cascade lasers - Quynh Sam · Cornell · PhD · 2025
Thermomechanical Nanomolding of Electronic Materials - Abeer Alsaggaf · Georgia Tech · PhD · 2025
A Heterogeneous Integrated Photonic Platform for High Sensitivity Sensors - Jakub Dranczewski · Imperial · PhD · 2025
On-chip III-V semiconductor network lasers for neuromorphic computing
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